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"Adhesion strength and contact resistance of flip chip on flex ..."
M. A. Uddin et al. (2004)
- M. A. Uddin, M. O. Alam, Yan Cheong Chan, H. P. Chan
:
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. Microelectron. Reliab. 44(3): 505-514 (2004)
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