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"Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison ..."

Bart Vandevelde et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.09.034

access: closed

type: Journal Article

metadata version: 2021-10-14

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Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne:
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectron. Reliab. 47(2-3): 259-265 (2007)

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