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"The effects of rheological and wetting properties on underfill filler ..."

Jinlin Wang (2007)

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DOI: 10.1016/J.MICROREL.2007.04.016

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jinlin Wang:
The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages. Microelectron. Reliab. 47(12): 1958-1966 (2007)

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