"A study of Cu/Low-k stress-induced voiding at via bottom and its ..."

Robin C. J. Wang et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.07.053

access: closed

type: Journal Article

metadata version: 2020-02-22

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Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao:
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectron. Reliab. 46(9-11): 1673-1678 (2006)

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