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"Reliability modeling on a MOSFET power package based on embedded die ..."

Dao-Guo Yang et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.02.026

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel:
Reliability modeling on a MOSFET power package based on embedded die technology. Microelectron. Reliab. 50(7): 923-927 (2010)

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