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"Measurement of high electrical current density effects in solder joints."

Hua Ye, Douglas C. Hopkins, Cemal Basaran (2003)

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DOI: 10.1016/S0026-2714(03)00131-8

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - https://dblp.org/rec/journals/mr/YeHB03
Hua Ye, Douglas C. Hopkins, Cemal Basaran:
Measurement of high electrical current density effects in solder joints. Microelectron. Reliab. 43(12): 2021-2029 (2003)

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