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"Characteristics of solderable electrically conductive adhesives (ECAs) for ..."

Byung-seung Yim et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.12.004

access: closed

type: Journal Article

metadata version: 2022-11-11

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Byung-seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim:
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging. Microelectron. Reliab. 52(6): 1165-1173 (2012)

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