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"Microstructures and properties of Bi10Ag high temperature solder doped ..."
Limeng Yin et al. (2018)
- Limeng Yin, Dong Li, Zongxiang Yao, Gang Wang, Adrian Blackburn:
Microstructures and properties of Bi10Ag high temperature solder doped with Cu element. Microelectron. Reliab. 80: 79-84 (2018)
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