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"Cu wire bond microstructure analysis and failure mechanism."

Cheng-Fu Yu et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.04.022

access: closed

type: Journal Article

metadata version: 2020-02-22

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Cheng-Fu Yu, Chi-Ming Chan, Li-Chun Chan, Ker-Chang Hsieh:
Cu wire bond microstructure analysis and failure mechanism. Microelectron. Reliab. 51(1): 119-124 (2011)

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