"Void control during plating process and thermal annealing of through-mask ..."

Chunsheng Zhu et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.12.019

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chunsheng Zhu, Wenguo Ning, Heng Li, Tao Zheng, Gaowei Xu, Le Luo:
Void control during plating process and thermal annealing of through-mask electroplated copper interconnects. Microelectron. Reliab. 54(4): 773-777 (2014)

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