"A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints."

David W. Capson, Sai-Kit Eng (1988)

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DOI: 10.1109/34.3902

access: closed

type: Journal Article

metadata version: 2017-05-17

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  - https://dblp.org/rec/journals/pami/CapsonE88
David W. Capson, Sai-Kit Eng:
A Tiered-Color Illumination Approach for Machine Inspection of Solder Joints. IEEE Trans. Pattern Anal. Mach. Intell. 10(3): 387-393 (1988)

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