"A High-Q Resonant Pressure Microsensor with Through-Glass Electrical ..."

Zhenyu Luo et al. (2014)

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DOI: 10.3390/S141224244

access: open

type: Journal Article

metadata version: 2023-10-23

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  - https://dblp.org/rec/journals/sensors/LuoCWLC14
Zhenyu Luo, Deyong Chen, Junbo Wang, Yinan Li, Jian Chen:
A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging. Sensors 14(12): 24244-24257 (2014)

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