"Automated Interlayer Wall Height Compensation for Wire Based Directed ..."

Jian Qin et al. (2023)

> Home

Details and statistics

DOI: 10.3390/S23208498

access: open

type: Journal Article

metadata version: 2024-10-06

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/sensors/QinVRLWCDWHT23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/sensors/QinVRLWCDWHT23
Jian Qin, Javier Vives, Parthiban Raja, Shakirudeen Lasisi, Chong Wang, Thomas Charrett, Jialuo Ding, Stewart Williams, Jonathan Mark Hallam, Ralph P. Tatam:
Automated Interlayer Wall Height Compensation for Wire Based Directed Energy Deposition Additive Manufacturing. Sensors 23(20): 8498 (2023)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.