"A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias ..."

Shuai Shao et al. (2017)

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DOI: 10.3390/S17020322

access: open

type: Journal Article

metadata version: 2018-11-30

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  - https://dblp.org/rec/journals/sensors/ShaoLNOSP17
Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, Seungbae Park:
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Sensors 17(2): 322 (2017)

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