"Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure ..."

Yunfan Zhang et al. (2021)

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DOI: 10.3390/S21062011

access: open

type: Journal Article

metadata version: 2021-05-26

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Yunfan Zhang, Bowen Li, Hui Li, Shengnan Shen, Feng Li, Wentao Ni, Wan Cao:
Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure Sensor. Sensors 21(6): 2011 (2021)

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