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"Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based ..."

Meng Zhang et al. (2019)

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DOI: 10.3390/S19010093

access: open

type: Journal Article

metadata version: 2019-10-19

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  dblp key:
  - journals/sensors/ZhangYHYYHSN19
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  persistent URL:
  - https://dblp.org/rec/journals/sensors/ZhangYHYYHSN19
Meng Zhang, Jian Yang, Yurong He, Fan Yang, Fuhua Yang, Guowei Han, Chaowei Si, Jin Ning:
Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via. Sensors 19(1): 93 (2019)

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