"CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, ..."

Lokesh Siddhu et al. (2022)

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DOI: 10.1145/3532185

access: open

type: Journal Article

metadata version: 2025-01-19

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Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda:
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. ACM Trans. Archit. Code Optim. 19(3): 44:1-44:25 (2022)

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