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"Area-I/O Flip-Chip Routing for Chip-Package Co-Design Considering Signal ..."

Jia-Wei Fang, Yao-Wen Chang (2010)

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DOI: 10.1109/TCAD.2010.2043586

access: closed

type: Journal Article

metadata version: 2020-09-24

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Jia-Wei Fang, Yao-Wen Chang:
Area-I/O Flip-Chip Routing for Chip-Package Co-Design Considering Signal Skews. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 29(5): 711-721 (2010)

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