"Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility ..."

Moongon Jung, David Z. Pan, Sung Kyu Lim (2013)

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DOI: 10.1109/TCAD.2013.2265372

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type: Journal Article

metadata version: 2022-10-02

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Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(11): 1694-1707 (2013)

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