"DM Interference Propagation Mathematical Modeling in SiC Wirebond ..."

Xiliang Chen et al. (2021)

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DOI: 10.1109/TCSII.2020.3041675

access: closed

type: Journal Article

metadata version: 2021-09-06

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Xiliang Chen, Wenjie Chen, Yu Ren, Xu Yang, Liang Qiao:
DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module. IEEE Trans. Circuits Syst. II Express Briefs 68(6): 2077-2081 (2021)

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