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"In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal ..."

Shifeng Guo et al. (2022)

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DOI: 10.1109/TIM.2022.3210962

access: closed

type: Journal Article

metadata version: 2023-11-03

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Shifeng Guo, Yangyang Huang, Dan Chen, Linlin Ren, Dawei Wang, Wei Feng:
In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution. IEEE Trans. Instrum. Meas. 71: 1-10 (2022)

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