"PCB Fault Identification With Multiscale Feature Fusion and Heat Source ..."

Zhangwei Wang et al. (2025)

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DOI: 10.1109/TIM.2025.3548815

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type: Journal Article

metadata version: 2025-04-08

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Zhangwei Wang, Haiwen Yuan, Jianxun Lv, Yingyi Liu, Hai Xu, Yingwei Zhang:
PCB Fault Identification With Multiscale Feature Fusion and Heat Source Attention Based on Multimodal Infrared Thermal Imaging. IEEE Trans. Instrum. Meas. 74: 1-13 (2025)

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