"Gold Wire Bonding Quality Inspection of Integrated Circuit Based on ..."

Yuan Zhang et al. (2025)

> Home

Details and statistics

DOI: 10.1109/TIM.2025.3552386

access: closed

type: Journal Article

metadata version: 2025-06-10

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tim/ZhangPNWSW25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tim/ZhangPNWSW25
Yuan Zhang, Chenghan Pu, Muyuan Niu, Qiaoyun Wu, Wei Sun, Jun Wang:
Gold Wire Bonding Quality Inspection of Integrated Circuit Based on Slenderness-Rotated Object Detection. IEEE Trans. Instrum. Meas. 74: 1-16 (2025)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.