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"Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D ..."

Dongjin Lee et al. (2018)

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DOI: 10.1145/3223046

access: closed

type: Journal Article

metadata version: 2022-01-03

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Dongjin Lee, Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty:
Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip. ACM Trans. Design Autom. Electr. Syst. 23(5): 60:1-60:25 (2018)

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