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"Composable thermal modeling and simulation for architecture-level thermal ..."

Hai Wang et al. (2013)

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DOI: 10.1145/2442087.2442099

access: closed

type: Journal Article

metadata version: 2023-03-01

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Hai Wang, Sheldon X.-D. Tan, Duo Li, Ashish Gupta, Yuan Yuan:
Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors. ACM Trans. Design Autom. Electr. Syst. 18(2): 28:1-28:27 (2013)

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