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"ILP-based Substrate Routing with Mismatched Via Dimension Consideration ..."

Jun-Sheng Wu, Chi-An Pan, Yi-Yu Liu (2023)

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DOI: 10.1145/3579843

access: closed

type: Journal Article

metadata version: 2023-10-27

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Jun-Sheng Wu, Chi-An Pan, Yi-Yu Liu:
ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design. ACM Trans. Design Autom. Electr. Syst. 28(5): 77:1-77:26 (2023)

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