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"Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a ..."

Jai-Ming Lin et al. (2021)

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DOI: 10.1109/TVLSI.2021.3100343

access: closed

type: Journal Article

metadata version: 2021-09-16

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  - https://dblp.org/rec/journals/tvlsi/LinCHSCL21a
Jai-Ming Lin, Wei-Yi Chang, Hao-Yuan Hsieh, Ya-Ting Shyu, Yeong-Jar Chang, Juin-Ming Lu:
Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC. IEEE Trans. Very Large Scale Integr. Syst. 29(9): 1652-1664 (2021)

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