![](https://dblp.org/img/logo.ua.320x120.png)
![](https://dblp.org/img/dropdown.dark.16x16.png)
![](https://dblp.org/img/peace.dark.16x16.png)
Остановите войну!
for scientists:
![search dblp search dblp](https://dblp.org/img/search.dark.16x16.png)
![search dblp](https://dblp.org/img/search.dark.16x16.png)
default search action
"Postbond Test of Through-Silicon Vias With Resistive Open Defects."
Rosa Rodríguez-Montañés, Daniel Arumí, Joan Figueras (2019)
- Rosa Rodríguez-Montañés
, Daniel Arumí
, Joan Figueras:
Postbond Test of Through-Silicon Vias With Resistive Open Defects. IEEE Trans. Very Large Scale Integr. Syst. 27(11): 2596-2607 (2019)
![](https://dblp.org/img/cog.dark.24x24.png)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.