"3-D Compact Marchand Balun Design Based on Through-Silicon via Technology ..."

Wei Xiong et al. (2022)

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DOI: 10.1109/TVLSI.2022.3170415

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type: Journal Article

metadata version: 2022-10-02

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Wei Xiong, Gang Dong, Yang Wang, Zhangming Zhu, Yintang Yang:
3-D Compact Marchand Balun Design Based on Through-Silicon via Technology for Monolithic and 3-D Integration. IEEE Trans. Very Large Scale Integr. Syst. 30(8): 1107-1118 (2022)

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