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"Full-Duplex Magnetic Induction Communication: Opportunities and Challenges."

Muhammad Muzzammil et al. (2024)

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DOI: 10.1109/MWC.021.2200619

access: closed

type: Journal Article

metadata version: 2024-08-12

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  - https://dblp.org/rec/journals/wc/MuzzammilAAQ24
Muhammad Muzzammil, Saif Al-Kuwari, Niaz Ahmed, Marwa K. Qaraqe:
Full-Duplex Magnetic Induction Communication: Opportunities and Challenges. IEEE Wirel. Commun. 31(4): 293-298 (2024)

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