"Exploiting die-to-die thermal coupling in 3D IC placement."

Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim (2012)

> Home

Details and statistics

DOI: 10.1145/2228360.2228495

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/dac/AthikulwongsePL12
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/dac/AthikulwongsePL12
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim:
Exploiting die-to-die thermal coupling in 3D IC placement. DAC 2012: 741-746

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.