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"Exploiting die-to-die thermal coupling in 3D IC placement."

Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim (2012)

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DOI: 10.1145/2228360.2228495

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim:
Exploiting die-to-die thermal coupling in 3D IC placement. DAC 2012: 741-746

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