"TSV stress aware timing analysis with applications to 3D-IC layout ..."

Jae-Seok Yang et al. (2010)

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DOI: 10.1145/1837274.1837476

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee, Sung Kyu Lim, David Z. Pan:
TSV stress aware timing analysis with applications to 3D-IC layout optimization. DAC 2010: 803-806

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