"Is TSV-based 3D integration suitable for inter-die memory repair?"

Mihai Lefter et al. (2013)

> Home

Details and statistics

DOI: 10.7873/DATE.2013.259

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

- view
  authority control:
- export record
  dblp key:
  - conf/date/LefterVTEHC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/date/LefterVTEHC13
Mihai Lefter, George Razvan Voicu, Mottaqiallah Taouil, Marius Enachescu, Said Hamdioui, Sorin Dan Cotofana:
Is TSV-based 3D integration suitable for inter-die memory repair? DATE 2013: 1251-1254

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.