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ORCIDCaleb Serafy
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2010 – 2019
- 2019
[j7]Zhiyuan Yang
, Caleb Serafy, Tiantao Lu, Ankur Srivastava:
Enhanced Phase-Driven Q-Learning-Based DRM for Multicore Processors. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(11): 2022-2031 (2019)- 2017
- [j6]Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava:
TSV-Based 3-D ICs: Design Methods and Tools. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1593-1619 (2017) - [c10]Zhiyuan Yang, Caleb Serafy, Tiantao Lu, Ankur Srivastava:
Phase-driven Learning-based Dynamic Reliability Management For Multi-core Processors. DAC 2017: 46:1-46:6 - [c9]Caleb Serafy, Zhiyuan Yang, Ankur Srivastava:
Design Space Modeling and Simulation for Physically Constrained 3D CPUs. ACM Great Lakes Symposium on VLSI 2017: 375-380 - 2016
- [j5]Caleb Serafy, Zhiyuan Yang, Ankur Srivastava, Yuanchen Hu, Yogendra Joshi:
Thermoelectric Codesign of 3-D CPUs and Embedded Microfluidic Pin-Fin Heatsinks. IEEE Des. Test 33(2): 40-48 (2016) - [j4]Yang Xie, Chongxi Bao, Caleb Serafy, Tiantao Lu, Ankur Srivastava, Mark M. Tehranipoor:
Security and Vulnerability Implications of 3D ICs. IEEE Trans. Multi Scale Comput. Syst. 2(2): 108-122 (2016) - [j3]Caleb Serafy, Avram Bar-Cohen, Ankur Srivastava, Donald Yeung:
Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling. IEEE Trans. Very Large Scale Integr. Syst. 24(4): 1515-1523 (2016) - [c8]Zhiyuan Yang, Caleb Serafy, Ankur Srivastava:
ECO Based Placement and Routing Framework for 3D FPGAs with Micro-fluidic Cooling. FCCM 2016: 199 - [c7]Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Ankur Srivastava:
Voltage Noise Induced DRAM Soft Error Reduction Technique for 3D-CPUs. ISLPED 2016: 82-87 - 2015
- [j2]Caleb Serafy, Ankur Srivastava:
TSV Replacement and Shield Insertion for TSV-TSV Coupling Reduction in 3-D Global Placement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(4): 554-562 (2015) - 2014
- [j1]Caleb Serafy, Bing Shi, Ankur Srivastava:
A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. Integr. 47(3): 307-317 (2014) - [c6]Caleb Serafy, Ankur Srivastava, Donald Yeung:
Unlocking the true potential of 3D CPUs with micro-fluidic cooling. ISLPED 2014: 323-326 - [c5]Caleb Serafy, Ankur Srivastava:
Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts. ISPD 2014: 55-62 - 2013
- [c4]Caleb Serafy, Bing Shi, Ankur Srivastava, Donald Yeung:
High performance 3D stacked DRAM processor architectures with micro-fluidic cooling. 3DIC 2013: 1-8 - [c3]Caleb Serafy, Ankur Srivastava:
Online TSV health monitoring and built-in self-repair to overcome aging. DFTS 2013: 224-229 - [c2]Caleb Serafy, Bing Shi, Ankur Srivastava:
Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. ACM Great Lakes Symposium on VLSI 2013: 275-280 - [c1]Bing Shi, Caleb Serafy, Ankur Srivastava:
Co-optimization of TSV assignment and micro-channel placement for 3D-ICs. ACM Great Lakes Symposium on VLSI 2013: 337-338
Coauthor Index
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