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Umamaheswara Rao Tida
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2020 – today
- 2024
- [j7]Madhava Sarma Vemuri
, Umamaheswara Rao Tida
:
Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC. IEEE Access 12: 23066-23080 (2024) - 2023
- [j6]Maliha Elma
, Madhava Sarma Vemuri
, Umamaheswara Rao Tida
:
Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter. IEEE Access 11: 90563-90574 (2023) - [c11]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology. ICCD 2023: 118-125 - [c10]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. ISQED 2023: 1-8 - [c9]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration. MWSCAS 2023: 187-191 - [c8]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. SOCC 2023: 1-6 - [i4]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. CoRR abs/2304.13808 (2023) - [i3]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. CoRR abs/2306.14032 (2023) - [i2]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration. CoRR abs/2306.14033 (2023) - 2022
- [j5]Chenyi Wen, Xiao Dong, Baixin Chen, Umamaheswara Rao Tida
, Yiyu Shi, Cheng Zhuo
:
Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter. ACM Trans. Design Autom. Electr. Syst. 27(5): 52:1-52:23 (2022) - 2020
- [j4]Umamaheswara Rao Tida, Cheng Zhuo
, Leibo Liu
, Yiyu Shi:
Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(2): 281-293 (2020) - [c7]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. MWSCAS 2020: 424-427 - [c6]Madhava Sarma Vemuri, Umamaheswara Rao Tida:
Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter. MWSCAS 2020: 933-936 - [c5]Umamaheswara Rao Tida, Madhava Sarma Vemuri:
Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. SoCC 2020: 195-200 - [i1]Dawei Li, Madhava Sarma Vemuri
, Umamaheswara Rao Tida:
An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits. CoRR abs/2001.10678 (2020)
2010 – 2019
- 2019
- [j3]Umamaheswara Rao Tida
, Cheng Zhuo
, Yiyu Shi:
Single-Inductor-Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery. IEEE Trans. Very Large Scale Integr. Syst. 27(10): 2305-2316 (2019) - 2018
- [c4]Baixin Chen, Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi:
Modeling and optimization of magnetic core TSV-inductor for on-chip DC-DC converter. ICCAD 2018: 16 - 2015
- [j2]Umamaheswara Rao Tida, Rongbo Yang, Cheng Zhuo, Yiyu Shi:
On the Efficacy of Through-Silicon-Via Inductors. IEEE Trans. Very Large Scale Integr. Syst. 23(7): 1322-1334 (2015) - 2014
- [j1]Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi:
Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 11(2): 16:1-16:14 (2014) - [c3]Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi:
Through-silicon-via inductor: Is it real or just a fantasy? ASP-DAC 2014: 837-842 - [c2]Umamaheswara Rao Tida, Varun Mittapalli, Cheng Zhuo, Yiyu Shi:
Opportunistic through-silicon-via inductor utilization in LC resonant clocks: concept and algorithms. ICCAD 2014: 750-757 - [c1]Umamaheswara Rao Tida, Varun Mittapalli, Cheng Zhuo, Yiyu Shi:
"Green" On-chip Inductors in Three-Dimensional Integrated Circuits. ISVLSI 2014: 571-576
Coauthor Index
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