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Boris Vaisband
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2020 – today
- 2024
- [c17]Yousef Safari
, Yushu Zhao
, Boris Vaisband
:
Co-DTC: Concentric Trench-Based Integrated Capacitors for Advanced Chiplet-Based Platforms. ACM Great Lakes Symposium on VLSI 2024: 1-6 - [e1]Inna Partin-Vaisband, Srinivas Katkoori, Lu Peng, Boris Vaisband, Tooraj Nikoubin:
Proceedings of the Great Lakes Symposium on VLSI 2024, GLSVLSI 2024, Clearwater, FL, USA, June 12-14, 2024. ACM 2024 [contents] - 2023
- [j8]Mousa Karimi
, Ataollah Saeed Monir
, Rezvan Mohammadrezaee, Boris Vaisband
:
CTT-Based Scalable Neuromorphic Architecture. IEEE J. Emerg. Sel. Topics Circuits Syst. 13(1): 96-107 (2023) - [j7]Yousef Safari
, Boris Vaisband
:
A Robust Integrated Power Delivery Methodology for 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31(3): 287-295 (2023) - [c16]Yousef Safari
, Pooya Aghanoury, Subramanian S. Iyer, Nader Sehatbakhsh, Boris Vaisband:
Hybrid Obfuscation of Chiplet-Based Systems. DAC 2023: 1-6 - [c15]Samuel Dayo, Ataollah Saeed Monir, Mousa Karimi, Boris Vaisband:
Statistical Weight Refresh System for CTT-Based Synaptic Arrays. ACM Great Lakes Symposium on VLSI 2023: 213-214 - [c14]Okyanus T. Gumus
, Mousa Karimi
, Boris Vaisband
:
Digital LIF Neuron for CTT-Based Neuromorphic Systems. ACM Great Lakes Symposium on VLSI 2023: 267-272 - [c13]Dima Al Saleh, Yousef Safari
, Fahad Rahman Amik, Boris Vaisband:
P* Admissible Thermal-Aware Matrix Floorplanner for 3D ICs. SOCC 2023: 1-6 - 2022
- [j6]Mousa Karimi
, Mohamed Ali
, Ahmad Hassan
, Reza Bostani, Boris Vaisband
, Mohamad Sawan
, Benoit Gosselin
:
A 7.6-ns Delay Subthreshold Level-Shifter Leveraging a Composite Transistor and a Voltage-Controlled Current Source. IEEE Access 10: 132432-132447 (2022) - [c12]Yousef Safari
, Anja Kroon, Boris Vaisband:
Power Delivery for Ultra-Large-Scale Applications on Si-IF. ISCAS 2022: 1605-1609 - [c11]Yousef Safari
, Boris Vaisband:
Integrated Power Delivery Methodology for 3D ICs. ISQED 2022: 114-119 - [i1]Yousef Safari, Anja Kroon, Boris Vaisband:
Power Delivery for Ultra-Large-Scale Applications on Si-IF. CoRR abs/2208.13034 (2022) - 2021
- [c10]Yousef Safari
, Boris Vaisband:
Power Delivery for Silicon Interconnect Fabric. ISCAS 2021: 1-5 - 2020
- [c9]Boris Vaisband, Ange Maurice, Chong Wei Tan, Beng Kang Tay, Eby G. Friedman:
Multi-Bit CNT TSV for 3-D ICs. ISCAS 2020: 1-5
2010 – 2019
- 2019
- [j5]Subramanian S. Iyer, SivaChandra Jangam
, Boris Vaisband
:
Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems. IBM J. Res. Dev. 63(6): 5:1-5:16 (2019) - [c8]Kannan K. Thankappan, Adeel Ahmad Bajwa, Boris Vaisband, SivaChandra Jangam, Subramanian S. Iyer:
Reliability Evaluation of Silicon Interconnect Fabric Technology. IRPS 2019: 1-5 - [c7]Boris Vaisband, Subramanian S. Iyer:
Global and semi-global communication on Si-IF. NOCS 2019: 15:1-15:5 - [c6]Boris Vaisband, Subramanian S. Iyer:
Communication Considerations for Silicon Interconnect Fabric. SLIP 2019: 1-6 - 2018
- [j4]Boris Vaisband, Eby G. Friedman:
Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems. Future Gener. Comput. Syst. 87: 152-158 (2018) - [c5]Boris Vaisband, Adeel Ahmad Bajwa, Subramanian S. Iyer:
Network on interconnect fabric. ISQED 2018: 138-143 - 2017
- [j3]Boris Vaisband, Eby G. Friedman:
Hexagonal TSV Bundle Topology for 3-D ICs. IEEE Trans. Circuits Syst. II Express Briefs 64-II(1): 11-15 (2017) - [c4]Boris Vaisband, Eby G. Friedman:
Hybrid energy harvesting in 3-D IC IoT devices. ISCAS 2017: 1-4 - 2016
- [j2]Boris Vaisband, Eby G. Friedman:
Noise Coupling Models in Heterogeneous 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 24(8): 2778-2786 (2016) - [c3]Boris Vaisband, Eby G. Friedman:
Layer ordering to minimize TSVs in heterogeneous 3-D ICs. ISCAS 2016: 1926-1929 - 2015
- [j1]Ioannis Savidis, Boris Vaisband, Eby G. Friedman:
Experimental Analysis of Thermal Coupling in 3-D Integrated Circuits. IEEE Trans. Very Large Scale Integr. Syst. 23(10): 2077-2089 (2015) - [c2]Boris Vaisband, Eby G. Friedman:
3-D floorplanning algorithm to minimize thermal interactions. ISCAS 2015: 2133-2136 - 2014
- [c1]Boris Vaisband, Ioannis Savidis, Eby G. Friedman:
Thermal conduction path analysis in 3-D ICs. ISCAS 2014: 594-597
Coauthor Index
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last updated on 2024-08-05 20:13 CEST by the dblp team
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