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ORCIDAndré Zimmermann
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2020 – today
- 2024
[j20]Patrick Tritschler
, Torsten Ohms, Bin Yang, André Zimmermann:
Meta-learning for few-shot sensor self-calibration to increase stress robustness. Eng. Appl. Artif. Intell. 138: 109171 (2024)- [j19]Faruk Civelek, Alexander Brem, Karl-Peter Fritz, André Zimmermann:
Product Development Processes for Individualized Products: A Case Study. IEEE Trans. Engineering Management 71: 6190-6204 (2024) - 2023
- [j18]Daniela Walter, André Bülau, André Zimmermann:
Review on Excess Noise Measurements of Resistors. Sensors 23(3): 1107 (2023) - 2022
- [j17]Monika Elisabeth Heringhaus, Alexander Buhmann, Jürgen Müller, André Zimmermann:
Graph neural networks for parameter estimation in micro-electro-mechanical system testing. Array 14: 100162 (2022) - [j16]Monika Elisabeth Heringhaus, Yi Zhang, André Zimmermann, Lars Mikelsons:
Towards Reliable Parameter Extraction in MEMS Final Module Testing Using Bayesian Inference. Sensors 22(14): 5408 (2022) - [j15]Jonas Jäger, Adrian Schwenck, Daniela Walter, André Bülau, Kerstin Gläser, André Zimmermann:
Inkjet-Printed Temperature Sensors Characterized according to Standards. Sensors 22(21): 8145 (2022) - 2021
- [j14]Michael Haub, Martin Bogner, Thomas Günther, André Zimmermann, Hermann Sandmaier:
Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning. Sensors 21(11): 3795 (2021) - [j13]Adrian Schwenck, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, André Zimmermann:
Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. Sensors 21(16): 5557 (2021) - [j12]Adrian Schwenck, Thomas Günther, André Zimmermann:
Characterization and Benchmark of a Novel Capacitive and Fluidic Inclination Sensor. Sensors 21(23): 8030 (2021) - 2020
- [j11]Benedikt Wigger, Ingo Koinzer, Thomas Meissner, Maximilian Barth, André Zimmermann:
Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns. Robotics Comput. Integr. Manuf. 63: 101925 (2020) - [j10]Martin Trotter, Daniel Juric, Zahra Bagherian, Nadine Borst, Kerstin Gläser, Thomas Meissner, Felix von Stetten, André Zimmermann:
Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications. Sensors 20(5): 1333 (2020) - [j9]Volker Kible, Robson Nunes de Lima, Karolinne B. Brito, André Bülau, André Zimmermann:
Quadrature Block for UHF Reflection Coefficient Measurements Using a Directional Coupler and Injection Locking. IEEE Trans. Instrum. Meas. 69(1): 275-285 (2020) - [j8]Alaa Fezai, Anuj Sharma, Wolfgang Müller-Hirsch, André Zimmermann:
Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques. IEEE Trans. Instrum. Meas. 69(7): 4908-4918 (2020)
2010 – 2019
- 2019
- [j7]Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, André Zimmermann:
A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation. IEEE Access 7: 56163-56173 (2019) - [j6]Lukas Lamprecht, Ricardo Ehrenpfordt, Tobias Zoller, André Zimmermann:
Application of human motion energy harvesters on industrial linear technology. IET Wirel. Sens. Syst. 9(2): 53-60 (2019) - 2018
- [j5]Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, André Zimmermann:
Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB. IEEE Access 6: 51669-51679 (2018) - [j4]Paul Wild, Dominik Lorenz, Tobias Grözinger, André Zimmermann:
Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectron. Reliab. 85: 163-175 (2018) - [j3]Jie Mei, R. Haug, O. Lanier, Tobias Grözinger, André Zimmermann:
Effect of Joule heating on the reliability of solder joints under power cycling conditions. Microelectron. Reliab. 88-90: 684-690 (2018) - 2017
- [j2]Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann:
Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. Sensors 17(7): 1511 (2017) - [j1]Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann:
Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. IEEE Trans. Reliab. 66(4): 1229-1237 (2017)
Coauthor Index
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