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ORCIDYang Du 0001
Person information
- affiliation: Qualcomm Research, San Diego, CA, USA
- affiliation (PhD 1994): Columbia University, New York, NY, USA
Other persons with the same name
- Yang Du — disambiguation page
- Yang Du 0002
![[0000-0003-1394-6359]](https://dblp.org/img/orcid-mark.12x12.png "0000-0003-1394-6359")
— Zhejiang University, College of Information Science and Electronic Engineering, Hangzhou, China (and 1 more) - Yang Du 0003 — University of Electronic Science and Technology of China, National Key Laboratory on Communuications, Chengdu, China
- Yang Du 0004 — Annoroad Gene Technology, Beijing, China (and 3 more)
- Yang Du 0005 — James Cook University, College of Science and Engineering, Cairns, Australia (and 3 more)
- Yang Du 0006 — University of Science and Technology of China, School of Computer Science and Technology, Hefei, China
- Yang Du 0007 — Liaoning Technical University, School of Geomatics, Fuxin, China
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Journal Articles
- 2017
[j5]Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim:
Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(6): 992-1003 (2017)- [j4]Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(8): 1265-1273 (2017) - [j3]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1716-1724 (2017) - 2016
- [j2]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim:
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(10): 1707-1720 (2016) - 2015
- [j1]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(4): 540-553 (2015)
Conference and Workshop Papers
- 2016
- [c10]Wei-Ting Jonas Chan, Yang Du, Andrew B. Kahng, Siddhartha Nath, Kambiz Samadi:
BEOL stack-aware routability prediction from placement using data mining techniques. ICCD 2016: 41-48 - 2015
- [c9]Wei-Ting Jonas Chan, Siddhartha Nath, Andrew B. Kahng, Yang Du, Kambiz Samadi:
3DIC benefit estimation and implementation guidance from 2DIC implementation. DAC 2015: 30:1-30:6 - [c8]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. DAC 2015: 92:1-92:6 - [c7]Karim Arabi, Kambiz Samadi, Yang Du:
3D VLSI: A Scalable Integration Beyond 2D. ISPD 2015: 1-7 - 2014
- [c6]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. DAC 2014: 62:1-62:6 - [c5]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim:
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC 2014: 206:1-206:6 - [c4]Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim:
Full chip impact study of power delivery network designs in monolithic 3D ICs. ICCAD 2014: 565-572 - [c3]Shreepad A. Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Design and CAD methodologies for low power gate-level monolithic 3D ICs. ISLPED 2014: 171-176 - [c2]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs. ISPD 2014: 47-54 - 2013
- [c1]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
High-density integration of functional modules using monolithic 3D-IC technology. ASP-DAC 2013: 681-686
Coauthor Index
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