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Robert Fischbach
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2020 – today
- 2024
- [c12]Andreas Krinke, Robert Fischbach, Jens Lienig:
Layout Verification Using Open-Source Software. ISPD 2024: 137-142 - 2020
- [c11]Tilman Horst, Robert Fischbach, Jens Lienig:
A Globally-optimized Co-design Approach for Heterogeneous Systems Using Convex Optimization. ECCTD 2020: 1-6
2010 – 2019
- 2019
- [c10]Robert Fischbach, Tilman Horst, Jens Lienig:
A Graph-Based Model of Micro-Transfer Printing for Cost-Optimized Heterogeneous 2.5D Systems. 3DIC 2019: 1-6 - [c9]Robert Fischbach, Tilman Horst, Jens Lienig:
Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing. DATE 2019: 956-959 - 2015
- [c8]Andy Heinig, Robert Fischbach:
Enabling automatic system design optimization through Assembly Design Kits. 3DIC 2015: TS8.31.1-TS8.31.5 - 2014
- [c7]Robert Fischbach, Andy Heinig, Peter Schneider:
Design rule check and layout versus schematic for 3D integration and advanced packaging. 3DIC 2014: 1-7 - [c6]Robert Fischbach, Michael Dittrich, Andy Heinig:
Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache. MBMV 2014: 183-192 - 2013
- [c5]Robert Fischbach, Johann Knechtel, Jens Lienig:
Utilizing 2D and 3D rectilinear blocks for efficient IP reuse and floorplanning of 3D-integrated systems. ISPD 2013: 11-16 - 2011
- [c4]Robert Fischbach, Jens Lienig, Johann Knechtel:
Investigating modern layout representations for improved 3d design automation. ACM Great Lakes Symposium on VLSI 2011: 337-342 - 2010
- [c3]Robert Fischbach, Jens Lienig, Matthias Thiele:
Solution space investigation and comparison of modern data structures for heterogeneous 3D designs. 3DIC 2010: 1-8 - [c2]Peter Schneider, Andy Heinig, Robert Fischbach, Jens Lienig, Sven Reitz, Jörn Stolle, Andreas Wilde:
Integration of multi physics modeling of 3D stacks into modern 3D data structures. 3DIC 2010: 1-6
2000 – 2009
- 2009
- [c1]Robert Fischbach, Jens Lienig, Tilo Meister:
From 3D circuit technologies and data structures to interconnect prediction. SLIP 2009: 77-84
Coauthor Index
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