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ORCIDJohn U. Knickerbocker
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2020 – today
- 2020
[j13]Gaddi Blumrosen
, Katsuyuki Sakuma, John Jeremy Rice, John U. Knickerbocker:
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing. IEEE Access 8: 35455-35468 (2020)
2010 – 2019
- 2019
- [c2]Katsuyuki Sakuma, Gaddi Blumrosen, John Jeremy Rice, Jeff Rogers, John U. Knickerbocker:
Turning the Finger into a Writing Tool. EMBC 2019: 1239-1242 - 2012
- [j12]Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman:
An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects. IEEE J. Solid State Circuits 47(4): 884-896 (2012) - 2011
- [j11]Paul W. Coteus, John U. Knickerbocker, Chung H. Lam, Yurii A. Vlasov:
Technologies for exascale systems. IBM J. Res. Dev. 55(5): 14 (2011)
2000 – 2009
- 2008
- [j10]John U. Knickerbocker:
Preface. IBM J. Res. Dev. 52(6): 539-540 (2008) - [j9]John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright:
Three-dimensional silicon integration. IBM J. Res. Dev. 52(6): 553-569 (2008) - [j8]Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker:
3D chip stacking with C4 technology. IBM J. Res. Dev. 52(6): 599-609 (2008) - [j7]Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker:
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM J. Res. Dev. 52(6): 611-622 (2008) - [j6]Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker:
Thermomechanical modeling of 3D electronic packages. IBM J. Res. Dev. 52(6): 623-634 (2008) - 2006
- [j5]John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte:
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE J. Solid State Circuits 41(8): 1718-1725 (2006) - 2005
- [j4]John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang:
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM J. Res. Dev. 49(4-5): 725-754 (2005) - [c1]John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes:
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. CICC 2005: 659-662 - 2002
- [j3]John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth:
An advanced multichip module (MCM) for high-performance UNIX servers. IBM J. Res. Dev. 46(6): 779-804 (2002)
1990 – 1999
- 1992
- [j2]Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond:
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. IBM J. Res. Dev. 36(5): 889-904 (1992) - 1991
- [j1]John U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk:
IBM System/390 air-cooled alumina thermal conduction module. IBM J. Res. Dev. 35(3): 330-341 (1991)
Coauthor Index
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