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"Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling ..."

Gengjie Chen et al. (2017)

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DOI: 10.1145/3061639.3062285

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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  - https://dblp.org/rec/conf/dac/Chen0ZZYY17
Gengjie Chen, Jian Kuang, Zhiliang Zeng, Hang Zhang, Evangeline F. Y. Young, Bei Yu:
Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network Design. DAC 2017: 70:1-70:6

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