"Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC."

Chang Liu et al. (2011)

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DOI: 10.1145/2024724.2024900

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim:
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. DAC 2011: 783-788

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