"A power-efficient 3-D on-chip interconnect for multi-core accelerators ..."

Kyungsu Kang et al. (2016)

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type: Conference or Workshop Paper

metadata version: 2021-08-09

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Kyungsu Kang, Sangho Park, Jong-Bae Lee, Luca Benini, Giovanni De Micheli:
A power-efficient 3-D on-chip interconnect for multi-core accelerators with stacked L2 cache. DATE 2016: 1465-1468

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