"On signalling over Through-Silicon Via (TSV) interconnects in 3-D ..."

Roshan Weerasekera et al. (2010)

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DOI: 10.1109/DATE.2010.5457013

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, Hannu Tenhunen:
On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits. DATE 2010: 1325-1328

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