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"Through-silicon-via management during 3D physical design: When to add and ..."

Mohit Pathak et al. (2010)

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DOI: 10.1109/ICCAD.2010.5653703

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  - https://dblp.org/rec/conf/iccad/PathakLML10
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim:
Through-silicon-via management during 3D physical design: When to add and how many? ICCAD 2010: 387-394

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