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"Electromigration modeling and full-chip reliability analysis for BEOL ..."
Mohit Pathak et al. (2011)
- Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim
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Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. ICCAD 2011: 555-562
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