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"Mechanical and chemical adhesion at the encapsulant interfaces in ..."

Philippe Nivelle et al. (2018)

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DOI: 10.1109/IRPS.2018.8353630

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  dblp key:
  - conf/irps/NivelleBVPDCD18
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  - https://dblp.org/rec/conf/irps/NivelleBVPDCD18
Philippe Nivelle, Tom Borgers, Eszter Voroshazi, Jef Poortmans, Jan D'Haen, Ward De Ceuninck, Michael Daenen:
Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules. IRPS 2018: 6

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