"Strategy to Characterize Electromigration Short Length Effects in Cu/low-k ..."

Zhenjun Zhang et al. (2021)

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DOI: 10.1109/IRPS46558.2021.9405161

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall:
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects. IRPS 2021: 1-5

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