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"Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs."

Zuowei Li et al. (2013)

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DOI: 10.1016/J.VLSI.2012.05.002

access: closed

type: Journal Article

metadata version: 2020-02-20

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  - journals/integration/LiMZCXH13
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  - https://dblp.org/rec/journals/integration/LiMZCXH13
Zuowei Li, Yuchun Ma, Qiang Zhou, Yici Cai, Yuan Xie, Tingting Huang:
Thermal-aware P/G TSV planning for IR drop reduction in 3D ICs. Integr. 46(1): 1-9 (2013)

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